| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging structure body that is improved in quality in packaging and supplies a large current without a trouble by increasing bending resistance, and to provide a method for manufacturing the packaging structure body and electronic equipment having the packaging structure body. SOLUTION: A wiring pattern 25 connected to an IC 10 for liquid crystal drive is changed into a thin line, and at the same time is densely aligned. A wide wiring pattern 26 is formed so that the wiring pattern 25 is sandwiched in the alignment direction D1 of the wiring pattern 25. COPYRIGHT: (C)2003,JPO
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