| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device allowing alignment between a light receiving part of an optical semiconductor element comprising a PD and an optical axis of an LD and an optical fiber to be performed easily with high accuracy in an assembling process of the optical semiconductor device and having high productivity and a low cost. SOLUTION: In a mounting base 1 on which a PD 4 is mounted, a recessed part is formed on a junction surface with a circuit board 20, and a conductive layer is formed on a bottom surface of the recessed part. The circuit board 20 is provided with a mounting part with a conductive layer formed on a top surface of a projected part formed on the top surface. The recessed part of the mounting base 1 is fitted and joined with the projected part of the circuit board 20. COPYRIGHT: (C)2003,JPO
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