| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which an electronic component to be mounted can be normally operated even when electronic component connecting pads are disposed in a high density without releasing the pads from an insulating board. SOLUTION: The wiring board comprises a ground conductor 11 having a plurality of electronic component connecting pads 8 and an opening 11a to surround the pads 8 at predetermined intervals and covering the upper surface of an insulating board 1, and a solder resistant resin layer 12 having an opening 12a to expose the center of the pad 8 on the conductor 11. In this board, the pad 8 are formed by partly cutting circles so that most approached sides becomes parallel to each other. COPYRIGHT: (C)2003,JPO
|
