发明名称 MULTILAYER CIRCUIT BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer circuit board where a plurality of insulating layers and wiring layers are alternately laminated for suppressing output of any unnecessary radiation noise emitted from the multilayer circuit board to an external board, and reducing the substrate area and costs. <P>SOLUTION: A coil pattern is formed on a wiring layer so that coil layers 21 and 25 can be formed, and a flat plate pattern is formed on a wiring layer different from the coil layers 21 and 25 so that a flat plane layer 23 can be formed. Wiring layers formed through insulating layers 12 and 13 positioned so as to be faced to the flat plate layer 23 are formed as GND layers 22 and 24, and a capacitor is formed of the flat plate pattern and the GND layers 22 and 24, and a filter circuit is configured of the capacitor and the coil pattern. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003273519(A) 申请公布日期 2003.09.26
申请号 JP20020068360 申请日期 2002.03.13
申请人 SOHWA CORPORATION 发明人 SHINDO SEIICHI
分类号 H05K1/16;H01F17/00;H01F27/00;H01G4/40;H03H7/075;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/16
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