| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent shift, short circuit and failure of joint of a semiconductor element due to fusion and solidification of a jointing agent in a semiconductor device where the semiconductor element is jointed to a pair of lead frames through a jointing agent, e.g. solder, while being held between. <P>SOLUTION: A hole 1a is made in a lead frame 1 being jointed to the upper surface electrode 3a of a semiconductor element 3 at a position corresponding to the upper surface electrode 3a, and a protrusion being fitted in the hole 1a is formed on the upper surface electrode 3a. Furthermore, a recess 2a is made in a lower lead frame 2 being jointed to the bottom face electrode of the semiconductor element 3 at a position corresponding to the bottom face electrode, and the semiconductor element 3 is placed in the recess 2a. <P>COPYRIGHT: (C)2003,JPO</p> |
