| 摘要 |
PROBLEM TO BE SOLVED: To realize miniaturization by reducing a mounting area. SOLUTION: A radio communication circuit is formed on a first board 2 in a multilayer board 4 obtained by stacking the first board 2 and a second board 3. A plurality of notches 6 are formed along the outer peripheral part of the second board 3 and a plating layer is formed on the inner peripheral surface of these notches 6 and the lower face side of the second board 3 in the vicinity of the notches 6 to constitute a terminal part. Since the upper part of the terminal part is formed to be planar by the first board 2, the radio communication circuit can be formed even at this part and a dead space generated by forming the notches 6 is eliminated. COPYRIGHT: (C)2003,JPO |
