| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for manufacturing a build-up printed wiring board whose plating copper adhesive strength, heat-resistivity, elasticity, and reliability are excellent by an additive method. SOLUTION: This mold release film B stage resin composition sheet with an additive base material adhered with a base material strengthening B stage resin composition layer is used for an additive resin composition layer formed on the surface of a mold release film. Furthermore, as at least the additive resin composition of the B stage resin composition with base materials, (a) multi-functional cyanic acid ester monomer and cyanic acid ester pre-polymer 100 wt.pts is mixed by (b) fluid epoxy resin 15 to 500 wt.pts in a room temperature, (c) heat curing catalyst 0.005 to 10 wt.pts is mixed with (a+b) 100 wt.pts as necessary components as resin slightly soluble in rarefactional solution to contain the resin composition as necessary components, and at least the two components of resin soluble in coarsening solution, organic power body, and inorganic power body are uniformly diffused in it. Therefore, it is possible to manufacture a multilayer printed wiring board whose copper adhesive strength and mechanical strength or the like is high, and whose heat resistivity and reliability are excellent. COPYRIGHT: (C)2003,JPO |
