发明名称 METHOD AND APPARATUS FOR MOUNTING COMPONENT
摘要 PROBLEM TO BE SOLVED: To achieve high-speed mounting by reducing a mounting time per unit component while obtaining the high accuracy of mounting. SOLUTION: This apparatus for mounting components comprises a component feeding part 4 that feeds a component 2 to a specified component feeding position, a mounting head 13 that holds and mounts the component 2, an X table 14 that linearly transports and positions the mounting head 13 from the component feeding position to a mounting position arranged at a specified position, and an XY table 15 that fixedly holds a board 3 to be mounted and positions the place on which the component 2 is mounted to the mounting position. By transporting the mounting head 13 between the component feeding position and the mounting position which are fixedly arranged, the transportation and positioning can be done within a short period of time while keeping high positioning accuracy. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003273137(A) 申请公布日期 2003.09.26
申请号 JP20020071183 申请日期 2002.03.15
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SHIDA SATOSHI;ONOBORI SHUNJI;KUKIHARA SATOSHI;TSUJISAWA TAKAFUMI;MAE TAKAHARU
分类号 H01L21/50;(IPC1-7):H01L21/50 主分类号 H01L21/50
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