发明名称 ADHESIVE COMPOSITION AND ADHESIVE SHEET
摘要 PROBLEM TO BE SOLVED: To solve the problem that an area of a conventional epoxy resin adhesive sheet expands 1.5-3.0 times the initial area thereof when the sheet is converted to an adhesive by laminating it on a circuit base and then by heating them under a pressure by a pressing machine. SOLUTION: In an adhesive composition comprising 100 pts.wt. of an epoxy resin, 100 pts.wt. of a thermoplastic resin, and 1-80 pts.wt. of a potential curing agent, 10-200 pts.wt. of a heat polymerizable compound and 0.1-10 pts.wt. of a heat polymerization initiator are contained therein. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003268337(A) 申请公布日期 2003.09.25
申请号 JP20020072126 申请日期 2002.03.15
申请人 DENKI KAGAKU KOGYO KK 发明人 SAITO TAKESHI;SAIDA SEIJI
分类号 C09J7/00;C09J4/00;C09J11/04;C09J163/00;(IPC1-7):C09J163/00 主分类号 C09J7/00
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