发明名称 Butt joined electronic assembly and module having an electrical standoff
摘要 A butt joined electronic assembly has first and second coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on at least a first standoff dielectric substrate and on first and second electrical elements. The standoff dielectric substrate is positioned in an abutting relationship with one of the electrical elements. The standoff dielectric substrate and the first and second electrical elements are secured on respective independently positioned and mechanically joined first and second open end face carriers. The first and second coplanar transmission structures are electrically coupled together via substantially flat electrical conductors.
申请公布号 US2003180009(A1) 申请公布日期 2003.09.25
申请号 US20020155465 申请日期 2002.05.23
申请人 YANG KEI-WEAN C. 发明人 YANG KEI-WEAN C.
分类号 G02B6/38;G02B6/42;(IPC1-7):G02B6/42 主分类号 G02B6/38
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