发明名称 MEMORY CELL STRUCTURE WITH TRENCH CAPACITOR AND METHOD FOR FABRICATION THEREOF
摘要 Within both a memory cell structure and a method for fabricating the memory cell structure there is employed a storage capacitor formed within a trench adjoining an active region of a semiconductor substrate. Within the memory cell structure and the method for fabrication thereof, both the active region of the semiconductor substrate and the trench are contained within a doped well within the semiconductor substrate.
申请公布号 US2003178661(A1) 申请公布日期 2003.09.25
申请号 US20020102280 申请日期 2002.03.20
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 TZENG KUO-CHYUAN;WANG CHEN-JONG;CHANG CHUNG-WEI
分类号 H01L21/334;H01L21/336;H01L21/8242;H01L21/8244;H01L27/108;H01L27/11;H01L29/76;H01L29/94;H01L31/119;(IPC1-7):H01L21/336 主分类号 H01L21/334
代理机构 代理人
主权项
地址