| 摘要 |
<p>The hybrid IC is constructed with use of protective transparent cover of polymeric material of high molecular weight by chip transfer replacement of a ceramic substrate. The process eliminates problems of joining a ceramic frame, glass, and a ceramic substrate. The manufacture includes the following stages: transfer of chip for direct mounting of the charge-coupled device on a printed circuit card by use of machine for connecting pins of the CCD chip to metallic pads of the printed circuit card; the use of machine for application of resin for tight sealing of the CCD chip along perimeter to the printed circuit card; and the use of assembly device for fastening a protective cover directly on the CCD chip, which comes tightly sealed after setting the resin. AN ADDITIONAL CLAIM is also included for the manufacturing process comprising the transfer of CCD chip for direct mounting on a ceramic base without pin supports, the use of machine for tight sealing along perimeter to the ceramic base, and the use of assembly device for fastening of protective cover directly on the chip, which becomes tightly sealed upon drying the resin. The ceramic base can have joining pins in the form of wings on both sides of the ceramic base, which are connected to the printed circuit card. The ceramic base can have joining pins on both sides, which are connected to the printed circuit card by use of openings.</p> |
