| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To quantitatively evaluate impact resistance of a connection part for an electronic component or an electronic element, so as to select a proper material precluded from being impaired in reliability for a long period and to specify a joining condition. <P>SOLUTION: This evaluation device is provided with a table for mounting a measuring sample, an arm having overlapping in its tip, and a fixing and releasing device for fixing and releasing the arm, and has a swing-up arm for swinging up the arm up to an optional angle, an analytical pattern recognizing device for investigating motion of the overlapping, and an analyzer for processing a signal from the pattern recognizing device to find an overlapping speed. <P>COPYRIGHT: (C)2003,JPO</p> |
