| 摘要 |
The semiconductor device is composed of a semiconductor die 1, and a lead frame 7 equipped with a die paddle 2 for mounting the semiconductor die and lead terminals 3, 4, 5, 6 for external connections, with the die paddle 2 and die paddle-side ends of the lead terminals 3, 4, 5, 6 being encapsulated together in a plastic package. The die paddle 2 is provided with links 14, 15, 16 which extend one by one between the lead terminals 3, 4, 5, 6. The extreme end of each link 14, 15, 16 is joined with adjacent lead terminals. The semiconductor die 1 is electrically connected with some of the lead terminals which correspond to a wiring pattern of an external circuit. Any of the links 14, 15, 16 uninvolved in the electrical connections is cut off.
|
