发明名称 |
Technique for improving chucking reproducibility |
摘要 |
Method and apparatus for improving the reproducibility of chucking forces of an electrostatic chuck used in plasma enhanced CVD processing of substrates provides for precoating of the electrostatic chuck with a dielectric layer, such as SiO2, after every chamber cleaning process. The uniform and tightly bonded dielectric layer deposited on the electrostatic chuck eliminates the need for a cover wafer over the chuck surface during the chamber cleaning and provides for more reliable gripping of wafers.
|
申请公布号 |
US2003180459(A1) |
申请公布日期 |
2003.09.25 |
申请号 |
US20030370028 |
申请日期 |
2003.02.18 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
REDEKER FRED C.;STEGER ROBERT;LI SHIJIAN |
分类号 |
B23Q3/15;C23C16/44;C23C16/458;H01L21/3065;H01L21/683;H02N13/00;(IPC1-7):C23C16/00 |
主分类号 |
B23Q3/15 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|