| 摘要 |
<p>Metal complex integrated structure and novel multidentate ligands serving as preferable raw materials of the metal complex integrated structure capable of being applied to miniaturization of various devices such as a CPU, a display, and a memory in the information communication field. The multidentate ligand contains four-nitrogen containing groups selected from a group consisting of imine, amide, and amino group, and has on the same plane at least two four-dentate plane coordination parts having the nitrogen in the four-nitrogen containing groups as coordination atoms on the same plane. Moreover, a metal complex chain composed of integrated metal complexes and a conductive wire containing a molecule showing a donor characteristic or an acceptor characteristic are intersected so that the metal complex and the molecule showing the donor characteristic or the acceptor characteristic are arranged in positions where they can interact each other, thereby constituting a metal complex integrated structure having 2-dimensional or 3-dimensional structure.</p> |
