| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for evaluating an octahedral void of a silicon wafer capable of easily and accurately evaluating a size, a shape, a location and a volume and the like of an octahedral void existing in a mirror-polished silicon wafer. SOLUTION: The method for evaluating an octahedral void of a silicon wafer detected as a light scattering body using a light scattering type surface inspection apparatus sequentially and repeatedly performs steps of a) detecting the light scattering body on the silicon wafer, b) forming an oxide film on the silicon wafer, and c) removing the oxide film on the silicon wafer by an acid etching treatment. COPYRIGHT: (C)2003,JPO
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