| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical automatic inspection device for a printed circuit board providing less inspection time by reducing the number of image processing data. <P>SOLUTION: Instead of directly comparing an image of the printed circuit board subjected to inspection and a model image pixel by pixel, the inspection device extracts an outline of a circuit patten of the print circuit board, obtains data by aggregating extremely short segments of sub-pixel accuracy, and maintains a defect detection sensitivity by extending or shortening a length of the segment, to reduce a data amount of a circuit pattern shape. Accordingly, the time required for image processing, specifically for comparing and determining whether to accept or reject, is reduced. <P>COPYRIGHT: (C)2003,JPO |
