| 摘要 |
PROBLEM TO BE SOLVED: To prevent variation of sensor characteristics due to thermal stress transmission to a semiconductor sensor chip of a semiconductor dynamic quantity sensor provided with a semiconductor sensor chip outputting signal based on an impressing of dynamic quantity, a circuit chip where the semiconductor sensor chip is loaded and supported, and a package member supported by loading the circuit chip even if applying to a sensor with high sensitivity to the impressed dynamic quantity. SOLUTION: Thermal stress transmitted by a semiconductor chip 5 from a control IC chip 3 can be mitigated by a second film-state adhesive 4, and thermal stress transmitted by a control IC chip 3 from a package member 1 can be mitigated by the first film-state adhesive 2. As the results, thermal stress transmitted to the semiconductor sensor chip 5 can be reduced more than conventional structure, and so even if it is applied to an acceleration sensor with higher sensitivity to the impressed acceleration, variation of the sensor characteristics can be prevented. COPYRIGHT: (C)2003,JPO |
