| 摘要 |
A viewport used by an end point detection system for chemical mechanical polishing (CMP) is attached to a platen that holds a CMP pad. During a CMP operation to polish a semiconductor wafer, the viewport is aligned with a hole in the CMP pad to permit optical access to the wafer by the end point detection system. The viewport shields optical components of the end point detection system from byproducts of the polishing, while also permitting the use of optical techniques to determine how much material has been polished from the surface of the wafer during the CMP operation.
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