发明名称 |
Packaging of a micro-magnetic switch with a patterned permanent magnet |
摘要 |
A method and apparatus for packaging a plurality of micro-magnetic switches is described. A bonded substrate structure includes a first substrate, a second substrate, and a magnetic layer. The first substrate has a plurality of cantilevers formed thereon. The second substrate has a first surface that is bonded to the first substrate. Each cantilever of the plurality of cantilevers on the first substrate is housed in a corresponding space formed between the first substrate and the second substrate. The magnetic layer is formed on a second surface of the first and/or second substrate to induce a magnetization in a magnetic material of each housed cantilever. The bonded substrate structure is singulated to form a plurality of separate micro-magnetic switch packages. Each micro-magnetic switch package of the plurality of micro-magnetic switch packages includes at least one housed cantilever.
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申请公布号 |
US2003179057(A1) |
申请公布日期 |
2003.09.25 |
申请号 |
US20030338042 |
申请日期 |
2003.01.08 |
申请人 |
SHEN JUN;GODAVARTI PRASAD S. |
发明人 |
SHEN JUN;GODAVARTI PRASAD S. |
分类号 |
H01H50/00;H01H51/22;(IPC1-7):H01H51/22 |
主分类号 |
H01H50/00 |
代理机构 |
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