| 摘要 |
<p>An optical module (200) used in fiber optic networking, and a method for manufacturing such an optical module, incorporates optoelectronic devices (210), image guide technology including optical fibers (204), high speed electronics (208), and integrated electronic packaging. In one realization, both the opto-electronic devices and the high-speed electronic devices are assembled into the module. The base of the module consists of an image guide (202) which has optical fibers embedded into it. The opto-electronic devices are 'flipchip-ed' onto the image guide within the module in such a manner as to eliminate the need for active alignment. The electronic devices are assembled into the optical module in close proximity with the optoelectronic devices in order to preserve wideband signal integrity. These devices are assembled with conventional flipchip and/or wirebond technology. Accordingly, the present invention eliminates the need for active alignment while simultaneously addressing the need for an optimal optical and electrical path. This in turn reduces the overall cost of the module assembly.</p> |
