| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a lead inspection method capable of correctly detecting the tip of a lead even in the state where a semiconductor element is housed in a pocket of a carrier tape. <P>SOLUTION: A carrier tape having a through-hole in the bottom part of each pocket is used. A transparent plate is previously disposed above the semiconductor element, and the upper surface of the body of the semiconductor element is pressed against the transparent plate by pressing up the semiconductor element so as to position the lead part of the semiconductor element in the outside of the pocket by tubular or rod-like support bodies through the through-hole. Each lead of the semiconductor is inspected by irradiating a lead with light from the upper side of the transparent plate and by receiving the light reflected from the lead of the semiconductor. <P>COPYRIGHT: (C)2003,JPO</p> |
