发明名称 EPOXY-BASED RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in crack resistance at a reflow and adhesion, especially adhesion to silver-plating, and having no unpleasant small when manufacturing and using. SOLUTION: The epoxy resin composition comprises a combination of: an epoxy resin (A); a curing agent (B); a filler (C); a silane coupling agent (D); and a deodorant (E), wherein the silane coupling agent (D) contains mercaptosilane as an essential component and the deodorant (E) contains one or more of a eucalyptus oil, 1,8-cineol and propylene oxide. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003268205(A) 申请公布日期 2003.09.25
申请号 JP20020075403 申请日期 2002.03.19
申请人 TORAY IND INC 发明人 SHIMIZU MICHIO;KATSUTA SHINYA;SHINTANI SHUICHI
分类号 C08L63/00;C08K5/151;C08K5/548;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08L63/00
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