| 摘要 |
For a semiconductor integrated circuit (IC) leadframe, a base metal sheet (10 in FIG. 3B) of a first metal, including copper, has substantially parallel first (11) and second (12) surfaces and an adherent layer of a second metal 13a and 13b), including nickel, covering both surfaces. A first layer (14) of a third metal, including palladium, adherent to the second metal, is pre-plated on the first surface in a thickness suitable for bonding wire attachment. On the opposite surface, a second layer (15) of the third metal is adherent to the second metal on the second surface in a thickness suitable for parts attachment. Alternatively, a layer of a fourth metal, including tin, is used for parts attachment. The leadframe structure is then stamped from the sheet so that the base metal is exposed at the stamped edges (10a in FIG. 3A). Finally, the exposed base metal is preferentially chemically etched so that it is contoured (10b) for maximum adhesion and imbued with affinity to polymeric compounds.
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