发明名称 PLASMA PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma processing apparatus in which a large and flat plasma beam opposite to a work to be processed is formed and a uniform film forming processing is performed on the work to be processed by using the plasma beam. <P>SOLUTION: The plasma processing apparatus 10 has a vacuum chamber 12, a plasma source 14 and a electrode part 16. The plasma source 14 has two plasma guns 22a and 22b, and two sheet plasma deforming parts 24a and 24b, which are arranged in parallel, respectively. The electrode part 16 has two columner plasma deforming parts 50a and 50b, and two electrodes 24a and 24b, which are arranged in parallel, respectively. Two sheet plasma beams SPB1 and SPB2, deformed from columner plasma beams at respective sheet plasma deforming parts 24a and 24b, are made incident into the vacuum chamber 12 in the state that the sheet planes are in parallel. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003268556(A) 申请公布日期 2003.09.25
申请号 JP20020063886 申请日期 2002.03.08
申请人 SUMITOMO HEAVY IND LTD 发明人 SAKAMI TOSHIYUKI
分类号 H05H1/11;B01J19/08;C23C16/507;H05H1/26 主分类号 H05H1/11
代理机构 代理人
主权项
地址
您可能感兴趣的专利