| 摘要 |
PROBLEM TO BE SOLVED: To form desired plating films by suppressing the elution of amorphous glass components in an object to be plated into an electroplating solution. SOLUTION: Prescribed amounts of compounds such as Na<SB>2</SB>SiO<SB>3</SB>, H<SB>3</SB>BO<SB>3</SB>and MgSO<SB>4</SB>, which contain Si, B and Mg as solid elements composing borosilicate glass at least containing SiO<SB>2</SB>, B<SB>2</SB>O<SB>3</SB>and MgO are previously added to an Ni plating solution, and electroless plating is performed, so that Ni-P films 4a to 4c are formed on external electrodes 3a to 3c formed on the surface of a ceramic base body 2. When Li<SB>2</SB>O, Al<SB>2</SB>O<SB>3</SB>, ZnO and Cu<SB>2</SB>O are contained in the borosilicate glass, compounds containing these metallic elements are suitably added to the plating solution, and then, electroless plating is performed. COPYRIGHT: (C)2003,JPO
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