| 摘要 |
A computer assembly is disclosed comprising a heat-generating component, one or more layers of thermally conductive material disposed upon a heat-emanating surface of the component, and a thermally conductive housing portion placed in physical contact with the one or more layers. Such an assembly enables the housing portion to act as a heat sink to effectively draw heat away from the component, and to dissipate that heat. Thus, heat is effectively removed from the component without the use of fans or heat pipes. |
