Process for bonding printed circuit film to injection molded plastics component, comprises using an adhesion modulator to break the bond by a given force to replace a faulty circuit

摘要

A printed circuit is bonded to an injection molded plastic component, together with an adhesion modulator so that, after shaping, the bond between the circuit film (12) and the plastics component (10) can be broken by a given force. The printed circuit is covered by fastening zones (14) of the plastics component, bonded to the component at bonding points (16a,16b) outside the circuit edges.