| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reliably detect a faulty connection between a terminal of a semiconductor chip and an external terminal of an MCP having a plurality of semiconductor chips mounted thereon. <P>SOLUTION: A semiconductor device has a dedicated terminal connected to each semiconductor chip, and a first terminal including a common terminal connected commonly to the semiconductor chips. At least two of the semiconductor chips have a connection test circuit and a switch circuit. The connection test circuit connects a first node in the semiconductor chip to a first voltage line in accordance with a level received from the first terminal. The switch circuit turns on in accordance with a level received from the dedicated terminal, and connects the first node to any of terminals including the dedicated terminal and the common terminal. Consequently, a connection test between the terminal of a semiconductor chip and the external terminal can be performed on each semiconductor chip by measuring a current flowing through the switch circuit while supplying a predetermined level to the dedicated terminal and the first terminal. <P>COPYRIGHT: (C)2003,JPO</p> |
