发明名称 POLYAMIC ACID COMPOSITION, SOLUBLE POLYIMIDE COMPOSITION, AND POLYBENZOXAZOLE-POLYIMIDE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a resin having a low permittivity and heat resistance. SOLUTION: Provided is a polyamic acid composition comprising repeating units represented by formula (1) [wherein R1 and R2 are each any one group selected from methylene, oxygen, C(CH3)2, C(CF3)2, and COO; R3 is any one group selected from hydrogen, a 1-10C hydrocarbon group, (meth) acryloyloxyethyl, (meth)acryloyloxy-n-propyl, (meth)acryloyloxy-i-propyl, and (meth)acryloyloxy-n-butyl; R4 is hydrogen, a 1-4C hydrocarbon group, a 1-4C alkoxyl, an ester group, carboxyl, or hydroxyl; R5 is hydrogen, a 1-6C hydrocarbon group, R6-CO, or R6COO (wherein R6 is a 1-4C hydrocarbon group); (p) and (q) are each an integer of 0-2; and (r) and (s) are each o or 1].
申请公布号 JP2001348428(A) 申请公布日期 2001.12.18
申请号 JP20000343220 申请日期 2000.11.10
申请人 TORAY IND INC 发明人 SUWA MITSUFUMI;FUJITA YOJI;SUGIMOTO KAZUNORI
分类号 C08G73/06;(IPC1-7):C08G73/06 主分类号 C08G73/06
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