发明名称 Al-SiC COMPOSITE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide an Al-SiC composite material which has a thermal expansion coefficient close to that of a ceramic substrate, has improved thermal conductivity and strength, and is prevented from warping. SOLUTION: This Al-SiC composite material is prepared by dispersing silicon carbide particles in a metal component mainly comprising aluminum. When the section of the interface between the metal component mainly comprising aluminum and the silicon carbide particle is observed, a reaction layer formed from the metal component and silicon carbide is not present at the interface. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003268482(A) 申请公布日期 2003.09.25
申请号 JP20020074609 申请日期 2002.03.18
申请人 HITACHI METALS LTD 发明人 FUKUI SATOSHI;OSHIMA MASAHIKO
分类号 C22C32/00;C22C1/10;C22C29/06;H01L23/373;(IPC1-7):C22C32/00 主分类号 C22C32/00
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