| 摘要 |
An aromatic polyimide film for producing an electro-conductive sealing element of a packaged semi-conductor device, has a thickness of 20 to 60 mum, a moisture vapor transmission coefficient of 0.05 to 0.8 g/mm/m<2>.24 hrs, a water absorption ratio of 2.0% or less, and an elastic modulus in tension of 5,000 MPa or more, in which a surface of the polyimide film has been treated with reduced-pressure plasma discharge.
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