发明名称 Film-shaped adhesive application apparatus
摘要 A film-shaped adhesive application apparatus includes a supply reel retainer for mounting a film-shaped adhesive supply reel used to wind into a roll shape a film-shaped adhesive 1 comprising a base film and an adhesive layer formed thereon, thermocompression bonding means for thermocompression-bonding the film-shaped adhesive drawn from the film-shaped adhesive supply reel to an adherend, and a winding reel retainer for mounting a winding reel used to wind the base film of the thermocompression-bonded film-shaped adhesive, and further temperature control means (thermal shield plate, cooler, or the like) for controlling the film-shaped adhesive supply reel mounted on the supply reel retainer at a prescribed temperature.
申请公布号 US2003178147(A1) 申请公布日期 2003.09.25
申请号 US20030378686 申请日期 2003.03.05
申请人 SONY CHEMICALS CORP. 发明人 KUMAKURA HIROYUKI;YAMADA YUKIO
分类号 B29C65/50;B29L9/00;B65H37/00;C09J5/00;H01L21/60;(IPC1-7):B32B31/00 主分类号 B29C65/50
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