发明名称 |
Apparatus and method for fabricating bonded substrate |
摘要 |
Disclosed is a bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
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申请公布号 |
US2003178134(A1) |
申请公布日期 |
2003.09.25 |
申请号 |
US20030347625 |
申请日期 |
2003.01.22 |
申请人 |
FUJITSU LIMITED |
发明人 |
MURAMOTO TAKANORI;OHNO TAKUYA;ADACHI TSUKASA;HASHIZUME KOJI;MIYAJIMA YOSIMASA;KOJIMA TAKAO |
分类号 |
G02F1/13;B32B38/18;G02F1/1333;G02F1/1339;G02F1/1341;G09F9/00;H01L21/68;H01L21/683;(IPC1-7):B32B31/00 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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