| 摘要 |
PROBLEM TO BE SOLVED: To attach and bond a counter substrate and an element substrate together while accurately controlling cell thickness and fabrication accuracy without causing the deterioration of pixels. SOLUTION: In steps S<SB>21</SB>-S<SB>23</SB>, sealant, vertically conductive material and a fixing member are formed on a TFT substrate. The fixing member is formed outside the sealant. That is, the fixing member is adequately separated from a pixel region, the TFT substrate and the counter substrate are attached together (step S<SB>25</SB>) and aligned and, at the same time, the fixing member is photoset (step S<SB>26</SB>). Therein, the pixel is not irradiated with the leakage light. In step S<SB>27</SB>, the sealant is properly cured by heat. In such a manner, the pixel is not irradiated with the leakage light, the pixel is not deteriorated and the assembly with high alignment accuracy and adequate strength can be performed. COPYRIGHT: (C)2003,JPO
|
