发明名称 METHOD FOR BONDING SEPARATOR AND ELECTRODE
摘要 PURPOSE: Provided is a method for bonding separators of different type with different anode and cathode materials by surface treatment including oxidation treatment(for example, plasma oxidation or solution oxidation) of at least one part of separator and electrode. CONSTITUTION: In the method for bonding an electrode, especially cathode or anode with separator, the separator is formed from other material than matrix material, and bonding of the separator and electrode is achieved with adhesive which cannot be dissolved in electrolyte. The adhesive is a thermal adhesive or polymerizable adhesive. The bonding is improved by oxidation treatment of surface of the separator, anode and/or cathode. The oxidation treatment is selected from plasma oxidation, solution oxidation or radical oxidation.
申请公布号 KR20020011491(A) 申请公布日期 2002.02.09
申请号 KR20000044780 申请日期 2000.08.02
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V. 发明人 HICK METRIPAT ATA MUSUTAPA
分类号 H01M2/26;(IPC1-7):H01M2/26 主分类号 H01M2/26
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