发明名称 COPPER-CLAD LAMINATED SHEET
摘要 PROBLEM TO BE SOLVED: To provide a copper-clad laminated sheet having a low dielectric constant and a low dielectric loss tangent capable of making the propagation frequency high, capable of being manufactured by an existing manufacturing apparatus and excellent in moldability, adhesiveness, multi-ply lamination, processability or the like. SOLUTION: A glass-epoxy copper-clad laminated sheet is constituted by laminating a plurality of prepregs, each of which is formed by impregnating a glass fiber substrate material with an epoxy resin composition and drying the impregnated glass fiber substrate material, and supperposing a copper foil on at least the single surface of the formed laminate to integrally mold the whole. The epoxy resin composition contains an epoxy resin (A) containing no halogen, a curing agent (B), a fire retardant (C) containing no halogen and a benzooxazine compound (D). The weight of the solid component of the benzooxazine compound (D) is 20-80% with respect to the sum total weight of the epoxy resin (A) containing no halogen, the curing agent (B), the fire retardant (C) containing no halogen and the benzooxanine compound (D). COPYRIGHT: (C)2003,JPO
申请公布号 JP2003266596(A) 申请公布日期 2003.09.24
申请号 JP20020072983 申请日期 2002.03.15
申请人 KYOCERA CHEM CORP 发明人 TANAHASHI YUSUKE
分类号 C08J5/24;B32B15/08;B32B17/04;(IPC1-7):B32B15/08 主分类号 C08J5/24
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