| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical liquid application apparatus capable of applying a chemical liquid such as resist to a substrate such as a wafer in the state that chemical liquid quality is maintained under optimum conditions, and a chemical liquid control method. <P>SOLUTION: The chemical liquid application apparatus comprises a coater cup 10 in which a wafer 14 is to be housed, a wafer chuck 16 and a spin motor 18 for holding the wafer in an approximately horizontal plane and rotating the wafer in the approximately horizontal plane, a coating nozzle 22 for dropwise titrating the resist on the surface of the wafer 14, a resist supply part 12 for storing and supplying the resist to the coating nozzle 22 through a pipe 40, and a control part 54 for discharging the resist stagnating in the pipe 40 for a prescribed stagnation time out of the coating nozzle 22 based on the characteristics of the resist. <P>COPYRIGHT: (C)2003,JPO |
