| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board which is equipped with an embedded electronic parts and a wiring layer which is formed on an embedding resin, high in adhesion to it, and kept free from trouble caused by an adhesion failure such as plating blisters or the like and capable of displaying its high reliability in a reliability test such as a thermal shock test, a water-resistant test and the like. SOLUTION: An electronic part is embedded in a wiring board by the use of embedding resin, where an interface between the embedding resin and a wiring layer is so roughened as to be 2 to 6μm in 10-point average roughness Rz. The embedding resin contains at least a kind of inorganic filler, and the inorganic filler content is adjusted so as to amount to 35 to 65 vol.%, by which the wiring layer can be effectively improved in adhesion.</p> |
