| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress the unevenness of a film and level the film to be formed on an object in the case of using a slit-nozzle type film formation apparatus. <P>SOLUTION: The film formation apparatus 10 is used for forming the film of a liquid material on a substrate, which is the object to be treated, by discharging the liquid material from a slit-nozzle 33 formed in a discharge head 21. A surface treatment part 40 treated so as to have an even wettability to the liquid material is formed in the peripheral part of the slit-nozzle 33 in the surface of the slit-nozzle 33. <P>COPYRIGHT: (C)2003,JPO |
