发明名称 PLATELIKE MEMBER POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To let a tape face of a polishing tape adhere closely to a polishing face of a platelike member by bringing the polishing tape into pressure contact with the platelike member by a pressure contact pad made of an elastic material to increase smoothing and surface coarseness of the polishing face and discharge chips satisfactorily due to strong or weak facial pressure of the polishing face of the platelike member and the tape face of the polishing tape due to the existence of a recessed part for chip escape formed on a pad face to suppress the occurrence of clogging. SOLUTION: A platelike member polishing device is composed of a holding base 4 capable of holding the platelike member, the polishing tape T capable of polishing the polishing face of the platelike member, a tape transfer mechanism 7 capable of transferring the polishing tape, a pressure contact member 21 capable of bringing the polishing tape into pressure contact with the platelike member, and a tape plane movement mechanism 32 for letting the pressure contact member perform plane movement. The pressure contact member is provided with the pressure contact pad 35 capable of bringing the tape face of the polishing tape into pressure contact with the polishing face of the platelike member and made of the elastic material, and the recessed part 36 for chip escape is formed on the pad face of the pressure contact pad. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003266294(A) 申请公布日期 2003.09.24
申请号 JP20020067952 申请日期 2002.03.13
申请人 SANSHIN CO LTD 发明人 HOSOGAI NOBUKAZU
分类号 B24B21/22;B24B21/00;(IPC1-7):B24B21/22 主分类号 B24B21/22
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