| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for printing with solder paste enabled to accurately print a fine pattern by stabilizing a print amount of solder paste to be printed by using a mask to prevent collapse of a print pattern. SOLUTION: A table 11 for fixedly supporting a circuit board B; a metal mask 21 arranged above the table; a squeegee 25 capable of printing with the solder paste P; and a vertically moving means capable of bringing an upper surface of the circuit board B contact to and separating it therefrom by vertically moving the table 11 are provided. After printing with the solder paste P onto the circuit board B, downward motion of the table is temporarily stopped on the way when the metal mask is separated by moving the table 11 downward. By recovering viscosity and adhesion of the solder paste, an adhesive state of the solder paste to the circuit board is stabilized, an amount of printing is stabilized and collapse of the printing pattern is prevented. COPYRIGHT: (C)2003,JPO
|
