发明名称 |
IC PACKAGE PRESSURE RELEASE APPARATUS |
摘要 |
An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern. |
申请公布号 |
EP1346409(A2) |
申请公布日期 |
2003.09.24 |
申请号 |
EP20010992402 |
申请日期 |
2001.10.27 |
申请人 |
INTEL CORPORATION |
发明人 |
SUR, BISWAJIT;NEOGI, SUDIPTO;RUMER, CHRISTOPHER;TAN, BOON, SENG |
分类号 |
H01L23/02;H01L21/50;H01L23/10 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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