LEAD-FREE SOLDER FOR FEEDING INTO SOLDER BATH

摘要

PROBLEM TO BE SOLVED: To develop a technique by which complicated labor such as the preparation, charge, stirring and the confirmation of concentration in a master alloy which has been performed in the case a master alloy having a high P concentration is charged in a small amount for additionally feeding P into a solder bath can be obviated. SOLUTION: A solder alloy containing 60 to 100 mass ppm P is fed to an Sn-Ag based or Sn-Ag-Cu based solder alloy for replenishing a solder bath against the reduction of a P content in the solder bath occurring in the process of the working of a jet, and the P content is retained. COPYRIGHT: (C)2003,JPO