发明名称 LASER BEAM MACHINE AND MACHINING METHOD
摘要 PROBLEM TO BE SOLVED: To divide plates after removing a product of a prescribed shape into a prescribed number of plates without damaging other products or machines. SOLUTION: On the assumption that the lateral width of the plate is divided into W, the vertical width is divided into H, and the W and H divisions are uniformly performed, a W division area m and an H division area n are determined with a uniformly divided position set to the center and an interval from one end side to the other end side of the plate is scanned at a pitch width P. When there is a line connecting the both end sides of the plate by a straight line without contacting or crossing with either of the respective circumferential sides of figure data for cutting off multiple components, or when there is a line connecting the both end sides of the plate which crosses a tangent of the straight line part or a curved line part at 70-110 deg. in a position crossing with the respective outer circumferential sides of the figure data, either of them is set to a cutting line.
申请公布号 JP2002337040(A) 申请公布日期 2002.11.26
申请号 JP20010143933 申请日期 2001.05.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 SHIBATA HIROAKI
分类号 B23Q15/00;B23K26/00;B23K26/38;G05B19/4097;(IPC1-7):B23Q15/00;G05B19/409 主分类号 B23Q15/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利