发明名称 |
Electroconductive paste and method for manufacturing a multilayer ceramic electronic part using the same |
摘要 |
An electroconductive paste is provided containing from about 5% to 18% by weight of an organic vehicle comprising a solvent and a binder, from about 80% to 93% by weight of an electroconductive metal powder in a spherical or granular shape and with a particle diameter in the range of about 0.1 to 50 mum, and from about 2% to 10% by weight of a resin powder with a particle diameter in the range of about 0.1 to 50 mum which is insoluble in the solvent and has a low level of water absorption. When this paste is used for forming via hole conductors to be converted to external electrode terminals, there is no problem of shape deformation of the via hole conductors. Furthermore, it is possible to restrict crack generation on the sintered electroconductive metal and to restrict breakage of the ceramic areas in the vicinity of the via hole conductors.
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申请公布号 |
US6623663(B2) |
申请公布日期 |
2003.09.23 |
申请号 |
US20010939467 |
申请日期 |
2001.08.24 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
OSHITA KAZUHITO;NAKAGAWA YOSHIKI |
分类号 |
C08K7/18;C08L23/12;C08L101/00;H01B1/22;H01G4/30;H01L23/12;H01L23/498;H05K1/09;H05K3/00;H05K3/40;(IPC1-7):H01B1/06;H01B1/02;C09D5/10 |
主分类号 |
C08K7/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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