| 摘要 |
A microelectromechanical circuit includes a packaging substrate having conductive features on its lower surface. The circuit may further include a microelectromechanical device formed upon the upper surface of the substrate, wherein an underside of at least one element of the device is in contact with the upper surface of the substrate. In some embodiments, the circuit may include one or more covers spaced above the substrate and the device. The circuit may further include a sealing structure laterally surrounding the device and interposed between the substrate and the covers. An array of microelectromechanical circuits may include a packaging substrate with first and second microelectromechanical devices laterally spaced upon its upper surface, first and second covers above the substrate and the first and second devices, and a sealing structure between the substrate and the first and second covers. A method for forming a microelectromechanical device may include forming the device upon a packaging substrate having one or more conductive features upon its lower surface.
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