发明名称 |
Chip scale surface mounted device and process of manufacture |
摘要 |
A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose portions of the electrode surface and to act as a passivation layer and as a solder mask. A solderable contact layer is then formed over the passivation layer. The individual die are mounted drain side down in a metal clip or can with the drain electrode disposed coplanar with a flange extending from the can bottom.
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申请公布号 |
US6624522(B2) |
申请公布日期 |
2003.09.23 |
申请号 |
US20010819774 |
申请日期 |
2001.03.28 |
申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
STANDING MARTIN;SCHOFIELD HAZEL DEBORAH |
分类号 |
H01L21/52;H01L21/60;H01L23/12;H01L23/31;H01L23/40;H01L23/492;H01L23/544;(IPC1-7):H01L23/48;H01L29/41 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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