发明名称 |
Method for forming a plane structure |
摘要 |
A method for forming plane structure. It comprises the following steps: forms a liquid material with a thicker thickness on a substrate, rotating both the liquid material and the substrate around the axis of the substrate, applying solvent on the rotating liquid material to remove partial liquid material. It also comprises the following steps: form a thicker removable material on a substrate, and partially remove the surface part of the removable material.
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申请公布号 |
US6624055(B1) |
申请公布日期 |
2003.09.23 |
申请号 |
US20020217471 |
申请日期 |
2002.08.14 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
HUANG JUI-TSEN;HUNG KUEI-CHUN |
分类号 |
H01L21/3115;(IPC1-7):H01L21/320;H01L21/302;H01L21/31 |
主分类号 |
H01L21/3115 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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